3D Inspector

Automatic optical inspection of wafer front surfaces in 3D

 

Product

Advantages

  • VCP USER Interface allows a fast setup creation for automation
  • Open and flexible SPA measurement script with modern creation technology
  • Professional map-networking with SPA

 

3D Inpector Basics

  • Inspection 6" and 8" wafer
  • Fully Automatic inspection workflow
  • Measuring equipment validity
  • Active anti-vibration damping system
  • ID Reading (via ethernet I/F)
  • Map reading, updating, creating
  • Chip inspection 100% or in sample mode
  • Speed optimized motorized stage and imaging

 

3D Inspector Options

  • Networks (TSK VEGAnet, EG Sortnet, TEL PN300, SPAwn)
  • SECSII/GEM
  • 6" and 8" frames
  • Full-featured inking functionality (see SPA-Inker)
  • Upgrade for 12" wafers and 12" frames
  • Online/Offline manual review of defect images
  • Open architecture for future add-ons

 

Inspection Features

  • High precision steepness measurement
  • High precision highest/lowest point measurement
  • Third dimension resolution: 1nm
  • Third dimension repeatition accuracy: 5 - 50nm (depending on material)
  • Lateral resolution: 5 - 100┬Ám
  • Lateral measuring field: 2mm^2 - 50mm^2
  • Miscellaneous other features (please contact us for more information)
  • Customer-specific project developments
 
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