SPA-Inker

 

Fast physical inking of wafers with 100% ink dot quality control

 

Product

Advantages

  • Increase inking quality using fast & complete inspection
  • Open & flexible concept for additional non-inking options
  • Professional map-networking with SPA

 

SPA-Inker Basics

  • Handling 6" and 8" wafer (other sizes on demand)
  • Fully Automatic with closed loop workflow
  • ID Reading (via ethernet I/F)
  • Map reading, updating, creating
  • 100% ink dot inspection
  • Ambient chuck

 

SPA-Inker Options

  • Networks (TSK VEGAnet, EG Sortnet, TEL PN300, SPAwn)
  • Frame handling (6" and 8")
  • 2 cassette ports
  • Ionizer
  • RGB illumination for balancing surface color anomalies
  • Hot chuck option (ERS/ATT)
  • Enhanced wafer baking technology
  • Waferedge detection to prevent off-wafer inking
  • Inkdot height measurement (definable sample amount)
  • Mastershot archive of complete inked wafer images
  • Open architecture for future add-ons (e.g. microscope)

 

Compatible Inker units

XANDEX X1412 Pneumatic Inker

  • As standard for large dots ~ 350-900 µm
  • Max. 7 dots/sec. for safe operation

XANDEX H2 Electrical Inking System Series 100

  • Dotsize 5-30 mil (~ 130-762µm)
  • Smallest dots ~ 130-250 µm
  • Slower (max. 5 dots/sec)

  (various other brands)

 

Inking Features

Inking

  • Inking and re-inking of dice according to wafer map
  • System inks all dice that are fail-bins according to wafer map
  • Bin-specific inking
  • Time-optimized inking (quadrant inking)
  • Inker cartridge limit control (dot amount, duration)
  • Inker cartridge type control via product setup (H2, special ink fluid)
  • Out of die center inking (recipe parameter)

Inspection

  • Inspection of all dice (inked and non-inked dice)
  • Ink splash detection (>50µm) on potential good dies
  • Ink dot inspection on position, shape and size (definable parameters)
  • Wafer inspection without inking possible (re-inking option)

 

Speed Examples

6" test wafer#1: 500 dice total, 100 bad dice

1. time loading 1st wafer (incl. ID-reading):  < 45 sec.
2. time wafer exchange: ~ 30 sec.
3. time to ink / wafer (ca. 3,7 dots/sec.): 27 sec.
4. time to inspect whole wafer (all dice): 15 sec.
TOTAL per 25 wafer lot: < 30 min.

 

6" test wafer#2: 2,050 dice total, 500 bad dice

   
1. time loading 1st wafer (incl. ID-reading):  < 45 sec.
2. time wafer exchange: ~ 30 sec.
3. time to ink / wafer (ca. 6,25 dots/sec.): 80 sec..
4. time to inspect whole wafer (all dice): 45 sec.
TOTAL per 25 wafer lot: < 65 min.

 inker5

inker2

 inker4

inker3