EBIS

 

Semi-automatic wafer backside inspection system


Synchronizes visual defects on the backside of a wafer to its frontside. Optimize your yield by precise marking of only the affected chips, no more oversized area marking!

“We make your wafers transparent”

 

 

Product

YOUR BENEFITS

•    Semi-automatic macroscopic defect detection on wafer backside
•    Visualization of complete wafer backside on the screen
•    Transparent wafer frontside overlay during backside defect marking
•    Automatic wafermap edit when backside defect is marked
•    Fast automatic loading and scanning process (up to 250 WPH)

TECHNICAL COMPONENTS

•    SPA UL200 autoloader
•    CIS high resolution image sensor with movement axis
•    Dome light illumination
•    Frontside camera for alignment and referencing

 

TECHNICAL SPECIFICATIONS

•    Wafer diameter up to 200mm (300mm on request)
•    Thin- and Taiko wafer on request
•    Backside scan resolution down to 21µm/px
•    Optional SECS/GEM compatible interface
•    Various adaptable wafermapping formats