PIA – Prober Inspection Addon

 

A multi-functional compact docking unit for existing probers.

 

 

 

Product

YOUR BENEFITS

•    100% inkdot quality control
•    Ink splash detection on good dies
•    Automatic reinking of inkdot failures
•    Wafer-specific RGB LED illumination settings
•    Archiving image of completely inked wafer
•    Optional SECS/GEM compatible interface

 

INSPECTION CRITERIAS

•    Inkdot size (min/max)
•    Inkdot position
•    Inkdot shape (roundness, aspect ratio)
•    Ink on pass chip detection
•    Individual inspection parameters for edge dies and active area

 

TECHNICAL COMPONENTS

•   2 telecentric inspection cameras
•    Automatic camera changer
•    RGB illumination
•    Inking equipment (pneumatic or electric)
•    Automatic needle tip measurement
•    Camera for needle tip visualization
•    Door lock

 

TECHNICAL SPECIFICATIONS

•    Wafer diameter up to 300mm
•    Chip size down to 200µm
•    Ink splash detection down to 30µm
•    Framed wafers (with automatic expansion compensation)

FOR PROBER VERSION

•    Control of prober via GPIB protocol
•    PIA replaces prober headplate
•    Weight incl. PIA-headplate ~80kg
•    Headplates 600mm, 640mm, 680mm or customized
•    Automatic headplate-hole opening/closing
•    Motorized PIA tilting system

 

 PIA